Direct-to-Device Phase Change Cooling
Sepolina 120
A decentralized, direct expansion cooler that sips energy and fits in the palm of your hand. Coupled to toolless connectors for a no mess and non-energy consuming, heat transportation path from cooling system to heat producing component(s). Both working simultaneously to remove heat and store excess cooling capacity within the heatsink connected to the heat producing components(s). An evolution in direct-to-chip cooling that will enable you to push your system(s) to the limit, while keeping your energy consumption in check.
Function
Sepolina Has 3 Sub-Systems working together to cool your heat producing componentry: Cooling System: A closed-loop, refrigerant based cooling system, scaled down, enclosed, and kept in proximity of the heat source requiring cooling. As all refrigerant stays within the boundaries of the cooling system, there obviously needs to be a method of transferring the heat towards the refrigerant. The next two components address that process directly. Heatsink (Freezeblock): A heatsink to be placed in direct contact with the heat producing device(s). Designed as a platform for connection to the thermal transport loop components. As well incorporating environment isolating materials that ensure heat transfers primarily towards the thermal transport loop. Thermal Transport Loop (Connector Loop): A series of tool-less interlocking sections, arranged in a user defined route, that bridges the gap between cooling system and the heatsink connected devices. Made of high thermal conductive material, with the primary goal of enabling thermal transport without incurring an energy expenditure. The thermal transport loop also incorporates environment isolating materials, to ensure thermal transfer occurs within the thermal transport loop.
| Material Property | Air | Water | Sepolina Thermal Transport Material | |
| Density (ρ) (Units - kg/m^3) | 1.19 | 997 | 2800 | 9000 |
| Specific Heat Capacity (Cp) (units - 10^3 J/Kg°C) | 1.005 | 4.186 | 0.800 | 0.350 |
| Volumetric Heat Capacity (ρ.CP) | 1.195 x 10^3 | 4.173 x 10^6 | 2.00 x 10^6 | 3.15 x 10^6 |
| Thermal Conductivity (W/m°C) | 0.026 | 0.61 | 160 | 340 |
| Requires Energy for Thermal Transportation | Yes | Yes | No | No |
Each material has physical properties that help determine selection as a medium of thermal transportation, such as the lower density of air requiring less energy to move, or the higher heat capacity of water holding more heat per volume moved. Both materials while capable of serving as coolant and medium of thermal transport, have properties which present reason for use as only a coolant. Namely the fact that air and water both require an energy expenditure to move the material toward and away from the source of heat. The possible thermal transport materials for Sepolina listed in the table above, avoid energy expenditures by maintaining continual direct contact with the source of heat and the method of cooling without motion. As well as containing material properties that enable superior rates of thermal transference. Thus, enabling the separation of coolant and thermal transport material properties into the most optimal selection for both roles.
| Method Minimum Amount | Sepolina | CRAC | CRAH | Direct-to-Device Liquid |
| Thermal Transport Mass (Units - g) | 30 | 100 | 100 | 6 |
| Allowable Temperature Delta (Units - °C) | 60 | 10 | 10 | 40 |
| Thermal Exhaust Kinetic Energy per 1m/s (units - J) | 0 | 0.05 | 0.05 | 0.003 |
All cooling systems exist to move heat away from the device producing heat towards the external environment. Typically, the phases of cooling involve: transference between heat source and cooling method, cooling the medium of transference, and exhausting the transfereed heat from the cooling cycle. Selecting a method to meet performance targets while consuming the least amount of energy or other resources is preferred. Utilizing a method of free-exhausting, where exhausted heat is transferred through a separate thermal transfer loop towards an ambient air-cooled heat exchanger. Sepolina is shown in the table above, to require zero energy during the exhausting phase of the cooling process. The benefits are not only of upfront energy savings during the transference of heat and cooling cycle of a heat producing device, but provide the possibility to eliminate energy consumption during the exhaust phase as well.
Sepolina Compared to...
CRAC/CRAH - Sepolina
CRAC/CRAH: Air, directed towards and away from heat source is the medium of thermal transport. The cooling system cooling fluid consists of: CRAC(refrigerant), CRAH(water - chilled or non-chilled). Sepolina: A series of solid connectors form a thermal transport loop that creates a continual, bi-directional path between the heatsink directly connected to the heat source and the cooling system. These components act as a medium of thermal transport and exchange. the cooling system cooling fluid consists of refrigerant which consumes the heat occurring within the thermal transport loop.
Process of Cooling Device
CRAC/CRAH: Air is propelled toward heat source to remove heat from the device to be transferred to the cooling system. Sepolina: Thermal transport loop transfers heat along the user determined path to the cooling system. CRAC/CRAH: Heated air is cooled via cooling system: CRAC(refrigerant), CRAH(water - chilled or non-chilled). Sepolina: Heat within thermal transport loop is removed via cooling system refrigerant. CRAC/CRAH: Cooled air is propelled back toward the heat source. Sepolina: Thermal transport loop acts as thermal battery to store excess cooling until more heat is transferred along the path.
Direct-to-Device Liquid - Sepolina
Direct-to-Device Liquid: Water is used as the medium of thermal transport and exchange via pumps, tubes/pipes and directly connected components, to create a loop between the heat source and cooling system. The cooling system removes heat from the water via: refrigerant(chilled), or air with/without evaporative methods(non-chilled). Sepolina: A series of solid connectors form a thermal transport loop that creates a continual, bi-directional path between the heatsink directly connected to the heat source and the cooling system. These components act as a medium of thermal transport and exchange. the cooling system cooling fluid consists of refrigerant which consumes the heat occuring within the thermal transport loop.
Process of Cooling Device
Direct-to-Device Liquid: Water is pumped towards the heat source in order to transfer heat away from the device and toward the cooling system. Sepolina: Thermal transport loop transfers heat along the user determined path to the cooling system. Direct-to-Device Liquid: Heated water is cooled via cooling system: chilled(refrigerant) , non-chilled(air with or without adiabatic/evaporative effects). Sepolina: Heat within thermal transport loop is removed via cooling system refrigerant. Direct-to-Device Liquid: Cooled water is propelled back to heat source Sepolina: Thermal transport loop acts as thermal battery to store excess cooling until more heat is transferred along the path.
Sepolina Sub-System Analogues
Cooling System
Sepolina's cooling system is similar to these aspects of other more traditional cooling systems: Water: The pump moves the substance responsible for thermal transfer away from the heat producing device to the primary cooling method. The radiator and fans then transfer the heat away from the thermal transfer substance and into the external environment. Air: Fans direct airflow to remove heat stored within the heatsink, heat pipes and radiator fins. Sepolina: Utilizing refrigerant evaporation, heat is transferred through the connector loop, from the freezeblock to the cooling system. The cooling system absorbs the transferred heat into the substance at in its coolest point in the direct expansion process. This heat converts the substance into its gas phase which is required to reinitialize the direct expansion process. The heat sent out into the external environment is only that which is created during the direct expansion process of cooling the pressurized gas, the heat from the heat producing device is absorbed in the process of converting the substance from liquid to gas.
Connector Loop
Sepolina's connector loop is similar to these aspects of other more traditional cooling systems: Water: The liquid, its flow path and the pump act as the connection between the heat producing device and the cooling system or method used. The properties of the liquid and its flow path, allow the heat transferred into the liquid from the heat producing device, to be transferred to the cooling system via the pumping device. Air: The heatsink and/or heat pipes, connected to the heat producing device, provide a thermal transfer path from the heat producing device to the cooling method used or additional heat storage methods. Sepolina: Individual connectors of various shapes, connected by proprietary methods, join together to make a flow path which connects the separated heat producing device and the cooling system. The connector material, with the aid of thermal interface materials, transfers heat from the heat producing device to the cooling system.
Freezeblock
Sepolina's Freezeblock is similar to these aspects of other more traditional cooling systems: Water: The heatsink, commonly referred to as a waterblock, is used to connect the heat producing device to the method of thermal transfer, which then transfers heat to the cooling system and stores heat for later utilization. Air: The heatsink is used to connect the heat producing device to the method of thermal transfer, which then transfers heat to the cooling system and stores excess heat for later utilization. Sepolina: The heatsink, referred to as the Freezeblock, is used to connect the heat producing device to the method of thermal transfer, which then transfers heat to the cooling system and stores heat for later utilization.
