Evolved Cooling Systems for Apex Efficiency
Sepolina 120
A decentralized, direct expansion cooler that sips energy and fits in the palm of your hand. Coupled to toolless connectors for a no mess and non-energy consuming, heat transportation path from cooling system to heat producing component(s). Both working simultaneously to remove heat and store excess cooling capacity within the heatsink connected to the heat producing components(s). An evolution in direct-to-chip cooling that will enable you to push your system(s) to the limit, while keeping your energy consumption in check.
Function
Sepolina Has 3 Sub-Systems working together to cool your heat producing componentry: Cooling System: Contains the phase change components which drive the primary method of cooling, directs cooling capacity to the Connector Loop via insulative methods, and utilizes built-in connection points for mounting directly within the system or external mounting via enclosure methods. Connector Loop: Is made up of solid individual connectors, when connected to each other, transfers heat away from heat producing components and stores excess cooling capacity to decrease duty cycle and power consumption of cooling system. Insulation between the connector housing and the heat transfer body, is used to prevent condensation and ensure heat transfer occurs within an isolated environment. FreezeBlock: Provides termination points for connector loop, while also acting as an initial heatsink to transfer heat away from the heat producing device. Mounting to the heat producing device is also completed via the housing of the FreezeBlock. Insulation between the FreezeBlock housing and heat transfer body, is used to prevent condensation and ensure heat transfer occurs within an isolated environment.
Sepolina Sub-System Analogues
Cooling System
Sepolina's cooling system is similar to these aspects of other more traditional cooling systems: Water: The pump moves the substance responsible for thermal transfer away from the heat producing device to the primary cooling method. The radiator and fans then transfer the heat away from the thermal transfer substance and into the external environment. Air: Fans direct airflow to remove heat stored within the heatsink, heat pipes and radiator fins. Sepolina: Utilizing convection, heat is transferred through the connector loop, from the freezeblock to the cooling system. The cooling system absorbs the transferred heat into the substance at in its coolest point in the direct expansion process. This heat converts the substance into its gas phase which is required to reinitialize the direct expansion process. The heat sent out into the external environment is only that which is created during the direct expansion process of cooling the pressurized gas, the heat from the heat producing device is absorbed in the process of converting the substance from liquid to gas.
Connector Loop
Sepolina's connector loop is similar to these aspects of other more traditional cooling systems: Water: The liquid, its flow path and the pump act as the connection between the heat producing device and the cooling system or method used. The properties of the liquid and its flow path, allow the heat transferred into the liquid from the heat producing device, to be transferred to the cooling system via the pumping device. Air: The heatsink and/or heat pipes, connected to the heat producing device, provide a thermal transfer path from the heat producing device to the cooling method used or additional heat storage methods. Sepolina: Individual connectors of various shapes, connected by proprietary methods, join together to make a flow path which connects the separated heat producing device and the cooling system. The connector material, with the aid of thermal interface materials, transfers heat from the heat producing device to the cooling system.
FreezeBlock
Sepolina's Freezeblock is similar to these aspects of other more traditional cooling systems: Water: The heatsink, commonly referred to as a waterblock, is used to connect the heat producing device to the method of thermal transfer, which then transfers heat to the cooling system and stores heat for later utilization. Air: The heatsink is used to connect the heat producing device to the method of thermal transfer, which then transfers heat to the cooling system and stores excess heat for later utilization. Sepolina: The heatsink, referred to as the FreezeBlock, is used to connect the heat producing device to the method of thermal transfer, which then transfers heat to the cooling system and stores heat for later utilization.
